Sequential Metallography

Sequential metallography is a microscopic/metallographic examination technique where a known amount of metal is removed and ground away from the surface of the metallographic specimen using a “step-wise” technique of examination, i.e., sample thickness measurement, additional grinding/polishing, etching, sample thickness measurement, examination (metallographic examination of the newly revealed surface, etc.). The depth and/or characteristic of a flaw/defect/crack can be sequentially evaluated.